During physical routing, an antenna violation is flagged on a long Metal 2 wire connected directly to the polysilicon gate of a receiver logic cell. Which of the following is a standard and effective Physical Design technique to resolve this specific violation?
The antenna effect is charge accumulation during plasma etching that can blow out a thin gate oxide. Jumping to a higher metal layer near the gate breaks the long wire during the fabrication step of the lower metal, preventing charge buildup on the gate. Adding a reverse-biased diode provides a safe discharge path to the substrate for the accumulated plasma charge. Both are standard fixes.
