A wafer has a 90% “Die Yield” (probability that a single die is good). If a multi-chip module (MCM) requires 4 of these dies to be functional to work, what is the approximate yield of the MCM?
Answer: C
Explanation: The probability of all 4 dies being good is $0.9^4 = 0.9*0.9*0.9*0.9 =~ 0.656, or roughly 65%. This demonstrates why chiplet-based yields are a major challenge for large systems.
